The integration of artificial intelligence (AI) into electronics has revolutionized the field, particularly in chip and packaging design. This special issue, titled " AI for Multiscale Analysis and Defect Identification in Packaging Structures and Semiconductor Chips," explores the significant impact of AI technologies on the electronics industry. AI, especially through machine learning (ML) and deep learning (DL), enables detailed multiscale analysis of electronic materials in advanced semiconductor chips, offering insights into their properties and behaviors. This understanding is crucial for optimizing interconnection designs and enhancing the performance and reliability of electronic packaging structures. Additionally, AI-powered defect identification improves quality control, ensuring higher precision and efficiency than traditional methods. The contributions to this issue highlight the latest advancements and innovative applications of AI in electronic materials analysis, interconnection structure optimization, and defect detection particularly in packaging structures and semiconductor chips. These advancements not only enhance current methodologies but also open new avenues for design and manufacturing in electronics.

Papers that solve original scientific problems in the field of AI for electronics materials, packaging structures, and chips are invited. We look forward to your submissions addressing the following topics:

• AI and Machine Learning for Multiscale Analysis;
• AI Design Optimization in Electronic Packaging;
• Defect Detection and Quality Control;
• Innovations in Chip and Package Reliability;
• Emerging AI Technologies in Electronics.