Shortcuts
1. Aims and Scope
2. Publishing Model
3. Copyright and License to Publish
4. Editorial Board
5. Editorial Policies
6. Peer Review
7. Manuscript Processing System
8. Research and Publication Ethics
9. Basic Information
10. Indexing & Archiving
11. Contact
1. Aims and Scope
Engineering Science in Additive Manufacturing (ESAM) aims to collate the cutting-edge research and review articles in additive manufacturing that highlight the engineering science. The journal covers all fundamentals of additive manufacturing, including its principles and applications. The journal publishes articles that acknowledge the significant development in the field and its disruptive nature in the industry. Topics of particular interest related to additive manufacturing include, but are not limited to:
- Theory and modelling
- Artificial intelligence
- Process enhancement
- Novel techniques
- New materials
- Emerging applications
ESAM provides a platform for publishing articles that advance the in-depth understanding of additive manufacturing. The journal also welcomes papers that employ theories, numerical methods and/or simulations that demonstrate relevance to the additive manufacturing community.
2. Publishing Model
Gold open access. All articles published by ESAM are made freely and permanently accessible online immediately from the date of publication. For further information, please refer to Open Access.
3. Copyright and License to Publish
Copyright
Copyright is retained by authors.
License
Articles in ESAM are published under a Creative Commons Attribution 4.0 International (CC BY 4.0). The CC BY 4.0 allows for maximum dissemination and re-use of open access materials and is preferred by many research funding bodies. Under this license users are free to share (copy, distribute and transmit) and remix (adapt) the contribution for any purposes, even commercially, provided that the users appropriately acknowledge the original authors and the source.
4. Editorial Board
For more information about the editorial team, please refer to Editorial Board.
5. Editorial Policies
All manuscripts submitted to ESAM should adhere to AccScience Publishing's Editorial Policies.
6. Peer Review
The journal adheres to rigorous peer review and undergoes double-blind peer review. For more details, please refer to Editorial Process.
7. Manuscript Processing System
ASP serves a diverse global community of scholars, committed to freely sharing cutting-edge research under the Creative Commons Attribution (CC BY) license. To enhance the precision, academic rigor, and timeliness of our publications, we have developed the proprietary, cutting-edge manuscript processing system known as the OSS (Online Submission System).
8. Publication Ethics Statement
ESAM fully adheres to the Code of Conduct and the Best Practice Guidelines of Committee on Publication Ethics (COPE).
The Editors of this journal enforce a rigorous peer-review process together with strict ethical policies and standards to guarantee to add high quality scientific works to the field of scholarly publication. Unfortunately, cases of plagiarism, data falsification, image manipulation, inappropriate authorship credit, and the like, do arise. The Editors of ESAM take such publishing ethics issues very seriously and are trained to proceed in such cases with a zero tolerance policy. To verify the originality of content submitted to our journals, we use CrossCheck (powered by iThenticate) to check submissions against previous publications.
9. Journal Information and Statistics
Digital archive: Portico
Frequency: Quarterly
DOI: 10.36922/ESAM
10. Indexing & Archiving
Engineering Science in Additive Manufacturing is indexed, cataloged and/or included by several world-class abstracting/indexing databases:
| Google Scholar | Crossref | Harvard University |
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| ScienceOpen | ASCI | EuroPub |
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| ESJI | Scribd | Copernicus |
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| OUCI | ||
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Archiving Service (Archives)
All published articles will be preserved here permanently: Portico.
11. Contact
Please visit the page of Editorial Office for details about different queries.










