Future of AM 2026 Successfully Concludes at Sands Expo Singapore | The 3rd Conference Officially Confirmed to Be Held in Wuhan, China
10 August 2026

Opening Summary

Held from 4 to 6 August at Sands Expo and Convention Centre, the 2nd International Conference on Future of AM 2026 has come to a successful end. Centered on the theme Advanced Manufacturing for Industry Transformation, the event was co-organized by AccScience Publishing, Chongqing Institute of Green and Intelligent Technology (CAS), Jiangnan University, Soochow University, Wuhan University of Science and Technology and other renowned academic institutions. 

Leveraging the strengths of Singapore's internationally renowned universities and research institutions, the event brought together top academicians, university chair professors, and leading R&D leaders from over 30 countries worldwide. Focusing on cutting-edge fields such as AI additive manufacturing, metallurgy, bioprinting, lattice metamaterials, 3D printing in architecture, food additive manufacturing, and intelligent manufacturing robots, the three-day event included multiple closed-door industry-academia-research matchmaking salons and journal-specific exchange sessions. Several transnational joint projects and university-enterprise technology transfer cooperation intentions were reached on-site. Post-event surveys showed a satisfaction rate as high as 95%, with most participating experts planning to continue participating in the Future AM series of conferences.

At the closing ceremony, the organizing committee officially announced that the 3rd International Conference on Future of AM will be hosted in Wuhan, China in 2027.

 

Official Attendance & Conference Statistics

  • Total participants: Over 300 delegates covering academia (62%), aerospace, medical, automotive and construction industrial R&D teams (31%), industrial standard organizations (7%), from 31 countries & regions;
  • Speaker lineup: More than 200 international speakers delivering keynotes, oral and invited presentations, with 260+ high-quality abstracts and full papers accepted;
  • Concurrent exhibition: 18 leading global exhibitors showcased LPBF, DED, bioprinting, robotic AM equipment, metal & bioink materials;
  • Post-event survey achieved a 95% satisfaction rate, with over 90% participants intending to join future editions.

 

Full Conference Tracks & Symposia (Based on Official Digital Booklet)

The three-day agenda featured 5 core parallel tracks plus 2 exclusive special symposia, covering the full spectrum of additive manufacturing from fundamental research to mass industrialization:

  1. Microstructures & Properties of Additively Manufactured Metal Alloys: LPBF/WAAM processes, casting & AM integration, powder recycling, melt pool in-situ monitoring, high-temperature alloy fabrication;
  2. 3D Bioprinting & Biomedical Applications: 4D dynamic hydrogels, organoid chips, patient-specific implants, regenerative medicine translational research;
  3. Meta-Materials, Lattices & Topological Optimisation: TPMS architectures, programmable 4D metamaterials, lightweight aerospace structural design;
  4. Automation & Robotics for AM: Multi-axis hybrid manufacturing, construction 3D printing robots, the landmark 11m stainless steel WAAM pedestrian bridge project at SUTD;
  5. AI & Multi-Scale Simulations: Physics-informed machine learning, digital twin production lines, real-time defect detection, LLM-driven process prediction;

Two Exclusive Special Symposia

  1. Additive Manufacturing of Future Food Systems (Day 2): Novel edible bioinks, AI customized nutrition printing, plant-based meat analogue fabrication;
  2. Advanced Manufacturing & Digital Innovation in Korea: Korean industrial AM case studies on composite coatings and microfabrication.

Additional industrial application sessions on Day 2 covered new energy, aerospace components, marine equipment and energy storage devices, while Day 3 focused on in-process monitoring and novel AM processing technologies.

 

World-Class Chair & Keynote Speakers

Conference Chair Team

General Chair: Professor Wai Yee Yeong, Dean, School of Mechanical and Aerospace Engineering, Nanyang Technological University

Co-Chairs: Distinguished Professor Chee Kai Chua (Wuhan University of Science and Technology), Dr. Sing Swee Leong (NUS), Professor Pablo Valdivia y Alvarado (SUTD)

Highlight Plenary Speakers

  • Professor Sang-Gook Kim (MIT): Agentic AI and the evolution of additive manufacturing
  • Professor Paulo Jorge Da Silva Bartolo (NTU): Cutting-edge biomanufacturing research at Singapore Centre for 3D Printing
  • Professor Xinhua Wu (Soochow University): Fatigue performance & prediction of 3D printed metallic parts

Professor Jay Lee (University of Maryland): Industrial physical AI and continuous machine learning for smart manufacturing


Journal Quick Publication Policy

All outstanding conference papers are eligible for special issue publication through quick publication pathway in 5 indexed journals under AccScience Publishing, including International Journal of Bioprinting (SCI-E, IF=6.8), Materials Science in Additive Manufacturing (ESCI, IF 4.4), Organoid Research, International Journal of Al for Materials and Design, and Engineering Science in Additive Manufacturing.


Official Announcement: Future of AM 2027 to Be Hosted in Wuhan

Wuhan University of Science and Technology and AccScience Publishing will jointly serve as the host of the 3rd International Conference on Future of AM from 26 to 28 March 2027. As China’s core hub for metallurgy, advanced materials and aerospace manufacturing, Wuhan boasts complete industrial chains and top-tier research platforms.


Closing Remarks

Future of AM 2026 has built a borderless high-end exchange platform integrating fundamental research, technical innovation and industrial translation. We sincerely invite global researchers, engineers and industrial partners to gather in Wuhan 2027 to jointly unlock the next era of additive manufacturing.

Official Website

https://futuream.sg

Stay tuned for updates on 2027 call for papers, venue information and partnership opportunities.